Introduction of low-pressure injection molding process and its application areas

The low-pressure injection molding process is a system packaging process method that injects hot melt material into the mold with very low injection pressure (1.5 to 40 bar) and cures the mold quickly (5 to 50 seconds), which consists of material, mold, equipment, and application technology.

It is mainly applied to the encapsulation and protection of precise and sensitive electronic components, including printed circuit boards (PCBs), automotive electronics, cell phone batteries, wire harnesses, waterproof connectors, sensors, micro switches, inductors, antennas, ring cords, etc.

Specific advantages of the low-pressure injection molding process are as follows.

I. Improve the performance of the end product, waterproof sealing, insulation and flame retardant, high and low-temperature resistance, and other characteristics

(1) Excellent encapsulation protection function.

(2) Very low injection pressure, no damage to components, very low defective rate.

II. Shorten the product development cycle and greatly improve production efficiency

(1) molding mold can be cast aluminum mold, very easy mold design, development, and processing manufacturing can shorten the development cycle.

(2) The curing process cycle is shortened from about 24 hours previously to within 5~50 seconds.
 

III. Reduce the total cost of production

(1) Significantly reduce the number of encapsulation materials.

(2) No need for an oven for curing, saving energy consumption.

(3) The use of lower-cost aluminum molds instead of steel molds.

(4) Eliminating the potting shell and water cooling system for the potting and sealing process.

(5) Due to low pressure and low temperature, the scrap rate of finished products can be greatly reduced and unnecessary waste can be avoided.

(6) Save the shelf, site, and corresponding time and labor cost for heating and curing equipment and process after potting or natural drying.